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Latest updates in semiconductor manufacturing and plasma processing
Samco Details SiO₂ Quasi-ALE Etch-Rate Stabilization Using O₂ Plasma at ALD/ALE 2026
1. What Was Presented Samco Inc. presented a poster titled "Stabilization of Etch Rate in SiO₂ Quasi-ALE Using an O₂ Plasma" at ALD/ALE 2026 — the AVS 26th International Conference on Atomic Layer Dep
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KTH's Scaffold Lift-Off Masks Pattern Conformal ALD Films on 3D Structures Down to 27 nm
What KTH Actually Demonstrated Researchers at KTH Royal Institute of Technology have published a method for patterning conformal thin-film coatings on complex three-dimensional structures, with demons
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imec, KU Leuven, Samsung, and Lam Research Detail a Monolithically Stackable Oxide-Semiconductor 3D-DRAM Cell in New July 2026 Paper
What Happened On July 21, 2026, Semiconductor Engineering highlighted a technical paper from imec, KU Leuven, Samsung Electronics, and Lam Research titled "Optimization of 3D-DRAM Architecture with Ox
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Fine-Pitch Hybrid Bonding Targets 6 µm for Volume as Roadmaps Push Toward 1 µm — The Deposition, CMP, and Surface-Prep Challenges Ahead
The Story: Proven in Production, Not Yet at Volume In a pair of technical features published July 16, 2026, Semiconductor Engineering laid out the process reality behind hybrid bonding's transition fr
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Samsung Publishes First System-Level Proof That Hybrid Copper Bonding Cuts HBM Stack Height 15% and Beats TCB on Heat
What Samsung Actually Measured Samsung Electronics has published what it describes as the first quantitative, system-level evidence that hybrid copper bonding (HCB) manages heat better than the thermo
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Samco RIE-800iPBC Cassette-to-Cassette DRIE System Selected by DTU Nanolab for Silicon Bosch-Process Etching
1. What Was Announced Samco Inc. announced that DTU Nanolab — the national nanofabrication facility at the Technical University of Denmark — will expand its silicon deep reactive ion etching (DRIE) ca
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UCLA Samueli Launches $125 Million Semiconductor Hub Backed by Broadcom, Applied Materials, GlobalFoundries, Meta and Synopsys
A First-of-Its-Kind Five-Year Pact On May 21, 2026, the UCLA Samueli School of Engineering unveiled a $125 million Semiconductor Hub backed by Broadcom, Applied Materials, GlobalFoundries, Meta and Sy
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Samsung Ships Industry-First 12-Layer HBM4E Samples at 3.6 TB/s, Six Months Ahead of SK Hynix
Samsung Begins HBM4E Sample Shipments — May 29, 2026 Samsung Electronics on May 29, 2026 began shipping the industry's first 12-layer HBM4E samples to major global customers, extending its high-bandwi
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Samsung Chip Union Ratifies $26.6 Billion Bonus Deal With 74% Vote, Averting 18-Day Strike at World's Largest Memory Maker
74% Yes Vote Closes Out an 18-Day Strike Threat Samsung Electronics' largest union ratified a 2026 wage agreement on May 27, with about 74% of voting members in favor, formally ending a labor standoff
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Huawei Unveils Tau Scaling Law and LogicFolding 3D-Stacked Architecture, Targets 1.4nm-Equivalent Density by 2031 Without EUV
1. The Shanghai Keynote On May 25, 2026, He Tingbo, chairman of Huawei's HiSilicon semiconductor division and a Huawei board member, delivered a keynote titled "New Semiconductor Path in Practice" at
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Applied Materials and EV Group Report 98% Yield on 450nm-Pitch Copper Hybrid Bonding Across 20 Million Interconnects at ECTC 2026
The Result: 450nm Pitch, 98% Yield, 20 Million Links At the 76th IEEE Electronic Components and Technology Conference (ECTC), running May 26–29 at the Grande Lakes resort in Orlando, Applied Materials
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Jensen Huang Flies to TSMC to Lock In Vera Rubin Capacity as Nvidia's Six-Chip Platform Pushes CoWoS Packaging Toward 130,000 Wafers a Month
Why Huang Landed in Taipei Three Days Before His Keynote Nvidia CEO Jensen Huang arrived at Taipei's Songshan Airport on Saturday, May 23, ahead of his GTC Taipei keynote on June 1 and the Computex 20
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