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Company updates, equipment deliveries, and notes from the teams supporting research and advanced manufacturing.
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imec Cuts CFET Bottom-pFET Access Resistance from 1,753 to 378 Ω·µm and Lifts Device Survival from 45% to 85%
What imec Reported On September 1, 2026, imec published Part 1 of a two-part report on advancing the complementary FET (CFET) roadmap, written by process integration engineer Cassie Sheng with Hiroaki
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TSMC Asks Suppliers for 5 µm HBM Microbumps — Halving HBM4's Bump Height Instead of Switching to Hybrid Bonding
What Changed On September 2, 2026, materials-industry sources reported that TSMC has asked its materials and equipment partners to develop bonding and underfill solutions for roughly 5 µm-class microb
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Hybrid Bonding in 2026: TSMC Ships 6 µm While Its Newest Disclosed Customer Stacks at 9 µm
Contents What Changed A September 2, 2026 Tom's Hardware feature consolidates where copper-to-copper hybrid bonding actually stands, and the picture is not a bottleneck — it is a gap between what the
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JVST A Industrial Perspective: Atomic Layer Etching Adds a Fourth Advantage — 90-Degree Sidewalls — as Low-k Fine Patterning Forces the RIE Handoff
What Was Published On August 28, 2026, AIP published a Scilights summary (DOI 10.1063/10.0046481) of a new perspective paper in the Journal of Vacuum Science & Technology A: "Current status of ato
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SK hynix Rules Out Hybrid Bonding for HBM4E: 775-Micron Ceiling Keeps MR-MUF Alive Through Nvidia Rubin
What Was Said, and Where On August 23, 2026, Jaesik Lee, VP of package engineering at SK hynix America, presented the company's HBM packaging roadmap at Hot Chips 2026. The headline result for anyone
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Lam Simulation Puts a Number on GAA Stress Non-Uniformity: 900 MPa Between Nanosheets, and Fin Lateral Etch Is a Primary Knob
What Was Published On August 25, 2026, Lam Research's Semiverse Solutions group published a study by Swapnil Kailash More applying SEMulator3D virtual fabrication with integrated stress modeling to ga
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Applied Materials Details Three HBM Packaging Bottlenecks: Sub-3µm TSV Fill, Bonding Flatness and Die Warpage
1. What Was Published On August 18, 2026, Applied Materials published a technical blog by Jinho An, Ph.D., Senior Director in the company's Heterogeneous Integration business unit, and product marketi
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Michigan and imec's "Common Earth" Project Targets the Two Materials Bottlenecks Inside Every Plasma Chamber: Rare-Earth Coatings and Fluorine
What Was Announced On August 15, 2026, IEEE Spectrum published an interview with the two University of Michigan researchers leading "Common Earth," a project run in collaboration with imec to find sub
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imec Model Explains Why the Bond Wave Accelerates in Direct Wafer-to-Wafer Bonding
1. What Was Published An imec researcher, Utkarsh Jain, has published an analytical treatment of bond front propagation in direct bonding, titled "Bond Front Velocity in Lubrication-Mediated Bonding o
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Samco Details SiO₂ Quasi-ALE Etch-Rate Stabilization Using O₂ Plasma at ALD/ALE 2026
1. What Was Presented Samco Inc. presented a poster titled "Stabilization of Etch Rate in SiO₂ Quasi-ALE Using an O₂ Plasma" at ALD/ALE 2026 — the AVS 26th International Conference on Atomic Layer Dep
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KTH's Scaffold Lift-Off Masks Pattern Conformal ALD Films on 3D Structures Down to 27 nm
What KTH Actually Demonstrated Researchers at KTH Royal Institute of Technology have published a method for patterning conformal thin-film coatings on complex three-dimensional structures, with demons
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imec, KU Leuven, Samsung, and Lam Research Detail a Monolithically Stackable Oxide-Semiconductor 3D-DRAM Cell in New July 2026 Paper
What Happened On July 21, 2026, Semiconductor Engineering highlighted a technical paper from imec, KU Leuven, Samsung Electronics, and Lam Research titled "Optimization of 3D-DRAM Architecture with Ox
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Fine-Pitch Hybrid Bonding Targets 6 µm for Volume as Roadmaps Push Toward 1 µm — The Deposition, CMP, and Surface-Prep Challenges Ahead
The Story: Proven in Production, Not Yet at Volume In a pair of technical features published July 16, 2026, Semiconductor Engineering laid out the process reality behind hybrid bonding's transition fr
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Samsung Publishes First System-Level Proof That Hybrid Copper Bonding Cuts HBM Stack Height 15% and Beats TCB on Heat
What Samsung Actually Measured Samsung Electronics has published what it describes as the first quantitative, system-level evidence that hybrid copper bonding (HCB) manages heat better than the thermo
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Samco RIE-800iPBC Cassette-to-Cassette DRIE System Selected by DTU Nanolab for Silicon Bosch-Process Etching
1. What Was Announced Samco Inc. announced that DTU Nanolab — the national nanofabrication facility at the Technical University of Denmark — will expand its silicon deep reactive ion etching (DRIE) ca
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UCLA Samueli Launches $125 Million Semiconductor Hub Backed by Broadcom, Applied Materials, GlobalFoundries, Meta and Synopsys
A First-of-Its-Kind Five-Year Pact On May 21, 2026, the UCLA Samueli School of Engineering unveiled a $125 million Semiconductor Hub backed by Broadcom, Applied Materials, GlobalFoundries, Meta and Sy
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Samsung Ships Industry-First 12-Layer HBM4E Samples at 3.6 TB/s, Six Months Ahead of SK Hynix
Samsung Begins HBM4E Sample Shipments — May 29, 2026 Samsung Electronics on May 29, 2026 began shipping the industry's first 12-layer HBM4E samples to major global customers, extending its high-bandwi
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Samsung Chip Union Ratifies $26.6 Billion Bonus Deal With 74% Vote, Averting 18-Day Strike at World's Largest Memory Maker
74% Yes Vote Closes Out an 18-Day Strike Threat Samsung Electronics' largest union ratified a 2026 wage agreement on May 27, with about 74% of voting members in favor, formally ending a labor standoff
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Huawei Unveils Tau Scaling Law and LogicFolding 3D-Stacked Architecture, Targets 1.4nm-Equivalent Density by 2031 Without EUV
1. The Shanghai Keynote On May 25, 2026, He Tingbo, chairman of Huawei's HiSilicon semiconductor division and a Huawei board member, delivered a keynote titled "New Semiconductor Path in Practice" at
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Applied Materials and EV Group Report 98% Yield on 450nm-Pitch Copper Hybrid Bonding Across 20 Million Interconnects at ECTC 2026
The Result: 450nm Pitch, 98% Yield, 20 Million Links At the 76th IEEE Electronic Components and Technology Conference (ECTC), running May 26–29 at the Grande Lakes resort in Orlando, Applied Materials
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Jensen Huang Flies to TSMC to Lock In Vera Rubin Capacity as Nvidia's Six-Chip Platform Pushes CoWoS Packaging Toward 130,000 Wafers a Month
Why Huang Landed in Taipei Three Days Before His Keynote Nvidia CEO Jensen Huang arrived at Taipei's Songshan Airport on Saturday, May 23, ahead of his GTC Taipei keynote on June 1 and the Computex 20
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Samsung Pitches MediaTek a Memory-for-Foundry Bundle to Pry 2nm Dimensity Volume From TSMC
The Pitch in Hsinchu Samsung Electronics Chairman Lee Jae-yong landed in Taiwan on May 21, 2026 and went directly to MediaTek's headquarters at the Hsinchu Science Park for closed-door talks. Accordin
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Deposition and Etch Intensity Is Doubling as 3D NAND Races Toward 1,000 Layers — SEMI Sees $136 Billion in Memory Equipment Spending Through 2028
The Throughline Behind the Equipment Boom: Intensity Is Doubling The record quarters reported across the wafer-fab equipment sector this spring share a single technical cause, and it is not simply tha
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Morgan Stanley Upgrades Lam Research to Overweight at $331, Calls 59% NAND Systems Growth in 2027
The Upgrade and the Numbers On Monday, May 18, 2026, Morgan Stanley upgraded Lam Research (LRCX) to Overweight from Equal-weight and raised its price target to $331 from $293. The shares were trading
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ASML to Equip India's First 300mm Commercial Fab: Tata Electronics Inks $11B Dholera Lithography Deal on May 16, 2026
Headline Deal Tata Electronics and ASML signed a Memorandum of Understanding on May 16, 2026 in The Hague, formally committing ASML to supply the lithography tools that will outfit India's first comme
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NEO Semiconductor Validates 3D X-DRAM in Silicon, Backed by Acer Founder Stan Shih — Built Entirely on 3D NAND Equipment
What Happened NEO Semiconductor announced successful proof-of-concept (POC) silicon results for its 3D X-DRAM technology, a vertically stacked DRAM architecture aimed at AI and data-centric systems. T
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Samsung Pulls Forward P5 Fab 2 by Six Months, Commits $82.7 Billion to a 600,000-Wafer Pyeongtaek Megasite
Table of Contents P5 Fab 2 Groundbreaking Pulled to July 2026 Samsung Electronics will break ground on P5 Fab 2 — the final production line at its Pyeongtaek campus in South Korea — in Jul
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Tower Semiconductor Posts $414M Q1 2026, Pours $920M Capex Into 5x Silicon Photonics Expansion
The Headline Numbers Tower Semiconductor (NASDAQ/TASE: TSEM) reported first quarter 2026 results before the open on May 13, 2026, posting revenue of $414 million — up 15% year-over-year from $358 mill
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Applied Materials and TSMC Forge $5 Billion EPIC Center Partnership to Accelerate AI Chip Scaling
The Deal: AMAT and TSMC at EPIC Center Applied Materials (NASDAQ: AMAT) and TSMC announced a new innovation partnership on May 11, 2026, formalizing co-development work at Applied's EPIC Center in Sil
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TSMC Reports April 2026 Revenue of NT$410.73 Billion (US$12.6B) — Year-to-Date Growth Hits 29.9% on AI Demand Surge
Headline Numbers Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM) on May 8, 2026 reported consolidated net revenue for April 2026 of approximately NT$410.73 billion (US$12.6 billion)
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Apple and Intel Reach Preliminary Foundry Deal; Intel Stock Jumps 14% as Foundry Validation Hits the Equipment Supply Chain
The Headline Deal Apple and Intel have reached a preliminary agreement under which Intel's foundry division will manufacture chips designed by Apple, The Wall Street Journal reported on May 8, 2026. T
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MKS Q1 2026 Hits $1.08 Billion as Plasma, Vacuum and RF Power for Deposition and Etch Surge
The Headline Numbers MKS Inc. (NASDAQ: MKSI) reported first-quarter 2026 revenue of $1.078 billion, up 15% year over year and 4% sequentially, with non-GAAP earnings per share of $2.30 — beating the $
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Veeco Books $250M+ in InP Laser Tool Orders as AI Optical Interconnect Drives Compound Semiconductor Deposition Supercycle
Contents The $250 Million Order Surge On May 5, 2026, Veeco Instruments Inc. of Plainview, NY disclosed that multiple customers had placed more than $250 million in equipment orders for its Spector io
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China Targets 70% Domestic Silicon Wafer Use by End of 2026 as Eswin Scales to 1.2 Million Wafers Per Month
The 70% Directive China is pushing its chipmakers to source more than 70% of their silicon wafers domestically by the end of 2026, according to a Nikkei Asia exclusive published May 5, 2026. The targe
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Intel EMIB-T Hits the Fab Floor in 2026: TSV Bridge Packaging for HBM4 Pulls New Demand for Deep Reactive Ion Etch and PECVD Liners
What Changed: EMIB-T Moves From Disclosure to Fab Rollout Intel's EMIB-T — Embedded Multi-Die Interconnect Bridge with Through-Silicon Vias — is moving from technology disclosure to production fab rol
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Applied Materials Buys ASMPT's NEXX for $120 Million, Adding Panel-Level Electrochemical Deposition for AI Chip Packages
The Deal at a Glance Applied Materials announced on May 3, 2026 that it has signed a definitive agreement to acquire the NEXX business of Hong Kong-listed ASMPT Limited (HKEX: 0522) for $120 million i
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Chinese Etch and Deposition Vendors Surge in Q1 2026: Piotech Revenue Up 57%, NAURA Up 26%, ACM Research Up 33%
1. Q1 2026 Headlines from China's Big Three The first quarter of 2026 closed with a clear signal that Chinese semiconductor equipment vendors are accelerating, not stalling, under U.S. export controls
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Tokyo Electron Posts Record JPY 2.44 Trillion FY2026, Guides First Half FY2027 Up 33% — Etch and Coater/Developer Lead the Charge
Summary Tokyo Electron on April 30, 2026 reported record fiscal-year results and issued first-half FY2027 guidance well above consensus, sending the stock up as much as 8.6% intraday. Net sales for th
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KLA Q3 FY2026 Hits $3.4B Revenue, Lifts WFE Outlook Above $140B as Advanced Packaging Revenue Heads to $1B
Headline Numbers KLA Corporation reported fiscal third-quarter 2026 results on April 29, 2026, posting revenue of $3.415 billion — up 11% year over year and 4% sequentially — and non-GAAP diluted EPS
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SCHMID Unveils "Any Layer ET" — A Full Panel-Level Damascene Platform Built on DRIE Plasma Etch and PVD Thin Film
Summary On April 30, 2026, SCHMID Group N.V. (NASDAQ: SHMD), the Freudenstadt-based equipment maker, introduced its proprietary Any Layer ET (Embedded Trace) Process — a full panel-level damascene pla
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SEMI: Q1 2026 Silicon Wafer Shipments Hit 3,275 MSI, Up 13.1% Year-on-Year on AI Data Center Demand
Story Summary SEMI today reported that worldwide silicon wafer shipments rose 13.1% year-on-year in the first quarter of 2026 to 3,275 million square inches (MSI), up from 2,896 MSI in Q1 2025. The fi
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Tokyo Electron Taiwan Hit With NT$150M Fine as Court Hands Ex-TSMC Engineer 10 Years for 2nm Etch Trade Secret Leak
A Landmark Ruling Under Taiwan's National Security Act On April 27, 2026, Taiwan's Intellectual Property and Commercial Court fined Tokyo Electron Taiwan NT$150 million (roughly US$4.6 million) and se
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ACM Research Ships First PECVD SiCN System: Saturn Series Three-Station Plasma Reactor Targets BEOL and Hybrid Bonding
Story Summary ACM Research (NASDAQ: ACMR) announced on April 27, 2026 that it has shipped its first plasma-enhanced chemical vapor deposition (PECVD) silicon carbonitride (SiCN) system to a leading se
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Micron CEO Mehrotra Pushes Congress to Cut CXMT and YMTC Off From Chip Equipment
What Happened Reuters reported on April 22, 2026, that Micron Technology has emerged as the leading corporate force pushing the U.S. Congress to tighten restrictions on chipmaking equipment sales to i
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TSMC Unveils A13 1.3nm Node, Arizona Packaging Plant by 2029, and Pauses ASML High-NA EUV Adoption
Contents TSMC Debuts A13 at the 2026 North America Technology Symposium At the 2026 North America Technology Symposium in Santa Clara, TSMC unveiled A13, branded as a 1.3nm-class node and positioned a
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SK hynix Q1 2026: Record 52.6 Trillion Won Revenue, 72% Operating Margin, M15X Fab Accelerates HBM Capex
Headline Numbers SK hynix reported first-quarter 2026 results on April 23, posting 52.5763 trillion won in revenue, 37.6103 trillion won in operating profit, and 40.3459 trillion won in net profit. Op
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Lam Research Posts Record $5.84 Billion Q3, Lifts 2026 WFE Forecast to $140 Billion
Headline Numbers Lam Research reported its fiscal third quarter 2026 results on April 22, delivering a third consecutive record quarter. Revenue reached $5.84 billion, up 9% sequentially and 24% year
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SK hynix Begins Mass Production of 192GB SOCAMM2 on 1c DRAM for NVIDIA Vera Rubin
The Headline SK hynix announced on April 20, 2026 that it has begun mass production of the industry's first 192GB SOCAMM2 (Small Outline Compression Attached Memory Module 2), built on its 1c-nanomete
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Intel Foundry Boosts Equipment Orders 50%+ as 14A Node Draws Apple, Nvidia, and AMD Interest
Equipment Orders Surge 50%+ Year-Over-Year Intel Foundry has ramped chipmaking equipment orders by more than 50% year-over-year since the start of 2026, according to a TrendForce report published Apri
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Aixtron Stock Jumps 7.75% to €44.08 as GaN MOCVD Demand for Nvidia 800V AI Data Centers Drives Deposition Equipment Rally
The Headline Move Shares of German deposition-equipment maker Aixtron SE (AIXA.DE) climbed 7.75% on Monday, April 20, 2026, closing at €44.08 on XETRA after opening at €43.94 and touching an intraday
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Terafab Sends Quote Requests to Applied Materials, Tokyo Electron, and Lam Research for Etchers and Depositors
The Procurement Outreach: Quotes Requested from the Big Three Staff working on Elon Musk's Terafab project have reached out to Applied Materials Inc., Tokyo Electron Ltd., and Lam Research Corp. seeki
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Samsung Achieves World-First 8nm MRAM at Mass-Production Yield, Plans 5nm by 2027
The 8nm MRAM Breakthrough Samsung Electronics announced at ISSCC 2026 (International Solid-State Circuits Conference) the first industry implementation of embedded MRAM (eMRAM) on an 8nm FinFET proces
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GlobalFoundries Breaks Ground on €1.1 Billion Dresden Expansion: 22nm FD-SOI, Embedded Memory, and BCD Drive Equipment Ramp Through 2028
Why Dresden? Europe's Strategic Anchor Fab GlobalFoundries' Fab 1 in Dresden is already the largest semiconductor manufacturing site in Europe, running 300mm wafers across a range of specialty nodes f
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ASML Posts €8.8 Billion Q1 Revenue, Raises 2026 Guidance to €36–40 Billion as AI Chip Demand Outstrips Supply
Table of Contents Q1 2026 Results Beat Expectations Across the Board ASML reported Q1 2026 total net sales of €8.8 billion, gross margin of 53.0%, and net income of €2.8 billion — translating to basic
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YMTC Plans 500,000-Wafer Monthly Capacity With Two New Wuhan Fabs as Domestic Equipment Crosses 50%
YMTC's Three-Fab Expansion Would Create World's Largest NAND Capacity Yangtze Memory Technologies (YMTC), China's largest NAND flash producer with an 11.8% global market share, is planning two additio
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6 Wall Street Firms Raise Lam Research Targets to $235–$325 Ahead of April 22 Earnings, Citing Etch and Deposition Supercycle
Table of Contents Six Analyst Upgrades in Six Weeks Lam Research (NASDAQ: LRCX) has received a wave of price target increases from six major Wall Street firms since early March, establishing a consens
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Gartner: Semiconductor Revenue to Hit $1.3 Trillion in 2026 as 'Memflation' Drives Record Equipment Demand
Table of Contents Gartner's $1.3 Trillion Forecast Gartner forecasts that worldwide semiconductor revenue will exceed $1.3 trillion in 2026, representing a 64% year-over-year increase — the strongest
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Section 232 Deadline Today: U.S. Trade Report Could Trigger Tariffs on $143B Semiconductor Equipment Market
Background: The January 14 Proclamation On January 14, 2026, President Trump issued a Presidential Proclamation under Section 232 of the Trade Expansion Act of 1962, initiating formal tariff actions o
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SanDisk and SK Hynix Activate HBF Equipment Supply Chain — TSV Etch, ALD, and PECVD Tools in Demand for Stacked NAND
What Is HBF and Why Does It Matter for AI? High Bandwidth Flash (HBF) is an emerging memory architecture that stacks multiple 3D NAND dies vertically and connects them to a logic base die through thro
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ASML Faces Crucial Q1 Test on April 15: €38.8 Billion Backlog Meets China Headwinds, 1,700 Job Cuts, and Analyst Downgrades
What to Expect on April 15 ASML Holding, the Dutch company that holds a 100% monopoly on extreme ultraviolet (EUV) lithography systems required for sub-7nm chip manufacturing, will report its first-qu
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China's Yttrium Export Controls Spark 140x Price Surge to $850/kg, Threatening Plasma Etch Equipment Supply Chain
Table of Contents From $6 to $850 per Kilogram in One Year Yttrium, a heavy rare earth element quietly essential to semiconductor manufacturing, has seen its price explode from roughly $6 per kilogram
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Samsung Posts Record 57.2 Trillion Won Q1 Profit as Memory Supercycle Fuels Equipment Demand
A Record Quarter Driven by AI Memory Samsung Electronics reported preliminary Q1 2026 operating profit of 57.2 trillion won (approximately $38 billion), a 755% surge from 6.69 trillion won in the year
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TSMC Posts NT$415 Billion March Revenue — 45% Surge Drives $54B Equipment Spending Cycle
March 2026 Numbers: NT$415.19 Billion, 45% YoY TSMC disclosed March 2026 monthly revenue of NT$415.19 billion on April 10, 2026 — a 45.2% year-over-year increase and a 30.7% sequential jump from Febru
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Applied Materials Launches 2 New Deposition Systems for 2nm GAA Chips: Precision Selective Nitride PECVD and Trillium ALD
Overview Applied Materials announced two new deposition systems on April 8, 2026, targeting the angstrom-era of logic chip manufacturing. The Applied Producer™ Precision™ Selective Nitride PECVD Syste
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Section 232 Semiconductor Tariff Deadline Arrives April 14 — Equipment Makers Brace for Phase 2
Contents The April 14 Deadline, Explained On January 14, 2026, President Trump signed a Presidential Proclamation under Section 232 of the Trade Expansion Act, imposing a 25% tariff on a narrow catego
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Global Semiconductor Equipment Billings Hit Record $135.1B in 2025, Taiwan Up 90% on AI-Driven TSMC Buildout
Full-Year 2025 Overview: $135.1 Billion and Up 15% SEMI published its full-year 2025 semiconductor equipment billings report on April 7, 2026, confirming that the global market reached a record $135.1
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SEMI: Global 300mm Fab Equipment Spending to Hit $133 Billion in 2026, $151 Billion in 2027 — AI Triggers Historic Investment Cycle
Overview: SEMI's April 2026 Forecast On April 1, 2026, SEMI published its latest 300mm Fab Outlook, projecting worldwide 300mm fab equipment spending will rise 18% to $133 billion in 2026 and a furthe
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Global Chip Sales Hit $88.8 Billion in February as Industry Races Toward $1 Trillion in 2026
February Sales Surge 61.8% Year-Over-Year The Semiconductor Industry Association reported on April 3 that global chip sales reached $88.8 billion in February 2026, a 7.6% increase over January's $82.5
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TSMC's 4 U.S. Fabs Now Fully Booked as Arizona 3nm Equipment Install Targets Q3 2026
All Four Arizona Fabs Now Reserved All four of TSMC's planned U.S. fabs in Arizona are now fully booked by customers, according to a March 24, 2026 report from TrendForce. Capacity at the first three
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Intel Pays $14.2 Billion to Reclaim Full Ownership of Ireland's Fab 34 From Apollo
The $14.2 Billion Buyback Intel announced on April 1, 2026 that it will repurchase the 49% equity interest in its Fab 34 joint venture from Apollo Global Management for $14.2 billion. Apollo had acqui
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Imec Installs $400M ASML EXE:5200 High-NA EUV — One of Fewer Than 12 Worldwide — Targeting Sub-2nm by Q4 2026
What Happened On March 18, 2026, Belgium-based research center imec announced that it has received and installed the ASML EXE:5200, the most advanced High-NA EUV lithography system in the world. The t
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China Targets 80% Chip Self-Sufficiency by 2030 With All-Domestic Etch and Deposition Equipment at 7nm
13 Industry Leaders Draft the 80% Plan Thirteen senior executives across China's semiconductor industry — including Yangtze Memory Technologies Chairman Chen Nanxiang and NAURA Technology Group Chairm
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Samsung and SK Hynix Pour $1.5 Billion Into China NAND Upgrades, Driving Surge in Deposition and Etch Equipment Demand
Samsung Completes 236-Layer Transition at Xi'an Samsung Electronics has completed the first phase of its process transition at its Xi'an NAND flash plant in Shaanxi province, fully phasing out legacy
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SK Hynix Places Record $8 Billion ASML EUV Order to Feed AI Memory Boom
The Deal: 30 EUV Scanners, Two Fabs, Two Years SK Hynix committed 11.95 trillion won (approximately $7.97 billion) to purchase roughly 30 extreme ultraviolet lithography machines from ASML, the larges
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Atlas Copco Acquires CVD Equipment's $16.9M Gas Delivery Division, Expanding Semiconductor Supply Chain Reach
The Deal: SDC Division Goes to Atlas Copco for $16.9 Million CVD Equipment Corporation (NASDAQ: CVV) announced on March 24, 2026, a definitive agreement to sell its Stainless Design Concepts (SDC) bus
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SEMI Projects Semiconductor Equipment Sales to Hit Record $156 Billion by 2027 as SEMICON China 2026 Draws 180,000 Attendees
SEMI's Record Equipment Forecast Global semiconductor equipment sales are on track to shatter records. According to SEMI, the industry trade association, total equipment sales by original equipment ma
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NineScrolls Partner Nano-Promiso Showcases Compound Semiconductor Solutions at SEMICON China 2026
NineScrolls partner Nano-Promiso showcased compound semiconductor solutions at SEMICON China 2026, featuring GaN/GaAs substrates and process equipment.
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Micron Posts Record $23.9B Quarter as HBM4 Demand Drives $25B Equipment Spending Spree
Q2 2026: 196% Revenue Surge Obliterates Estimates Micron Technology reported fiscal Q2 2026 results on March 26 that shattered Wall Street expectations. Revenue hit $23.86 billion, up 196% year-over-y
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Samsung Begins Installing 2nm Equipment at $44B Taylor, Texas Fab as EUV Trials Go Live
First 2nm Equipment Arrives in Taylor Samsung's Taylor, Texas fab has begun receiving its first batch of semiconductor manufacturing equipment compatible with the 2nm process node. EUV lithography tri
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Penn State's Atom-Thin CrOCl Achieves 200:1 Plasma-Etch Selectivity, Outperforming Every Conventional Hard Mask
The Breakthrough: A 2D Material That Plasma Cannot Etch Researchers at Penn State University have published findings in Nature Materials showing that chromium oxychloride (CrOCl), a two-dimensional va
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Chip Equipment Makers Post 16% Revenue Surge as AI Demand Drives Eight Straight Quarters of Double-Digit Profit Growth
Nine Equipment Giants Hit 16% Combined Growth The world's nine largest semiconductor equipment manufacturers are posting a combined 16% year-over-year revenue increase for Q1 2026, with net profits ju
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Musk's $25B Terafab Could Require Over 5,000 Plasma and Deposition Tools to Hit 2nm Production
Contents The Terafab Announcement: $25 Billion, One Roof On March 21, 2026, Elon Musk officially launched Terafab — a joint semiconductor fabrication venture between Tesla, SpaceX, and xAI — with a pr
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University of Arizona Opens $35.5M Semiconductor Cleanroom With 12-Inch Wafer Capability
Cleanroom Doubles in Size With $35.5 Million Investment The University of Arizona has opened its newly expanded Nanofabrication Core Facility inside the Electrical and Computer Engineering Building in
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Applied Materials and Lam Research Circle $15 Billion Bid for Hybrid Bonding Leader BESI
The Bidding War The two largest U.S. semiconductor equipment makers are fighting over the same target. Applied Materials and Lam Research are both exploring multi-billion-euro offers for BE Semiconduc
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Nvidia's $1 Trillion Order Book Sends Shockwave Through Semiconductor Equipment Supply Chain
Nvidia's $1 trillion chip order book through 2027 drives record semiconductor equipment demand, with TSMC investing $56B in deposition and etch tools.
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Tokyo Electron Brings Quad-Reactor Plasma Deposition System to Production in 2026
The Episode 2 QMR System Tokyo Electron (TEL) is bringing its Episode 2 QMR (Quad Matched Reactor) system to full production in 2026. The QMR module deposits thin films on four wafers simultaneously u
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Applied Materials Launches Three New Deposition and Etch Systems for 2nm GAA Transistors
The Announcement At SEMICON Korea on February 10, 2026, Applied Materials unveiled three new semiconductor manufacturing systems engineered for 2nm gate-all-around (GAA) nanosheet transistors and adva
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AlixLabs Raises €14.1 Million to Disrupt Semiconductor Patterning with Atomic Layer Etch Pitch Splitting
The Funding Round Swedish startup AlixLabs closed a €14.1 million ($16.3 million) Series A round in late 2025. The round was co-led by long-time backers Navigare Ventures, Industrifonden, and FOR
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Lam Research and CEA-Leti Expand Deposition R&D with Pulsed Laser and Molybdenum ALD Systems
The Expanded Partnership On February 2, 2026, Lam Research and France's CEA-Leti announced a new multi-year agreement to advance the fabrication of next-generation specialty technology devices. The co
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ASM International Builds $320 Million ALD Innovation Hub in Arizona as Market Share Exceeds 55 Percent
The Arizona Expansion ASM International, the Dutch semiconductor equipment maker that controls over 55 percent of the ALD market segments it competes in, is investing more than $320 million in a new c
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TSMC Ramps 2nm Production Toward 140,000 Wafers per Month, Driving Record Deposition Equipment Demand
The 2nm Ramp TSMC commenced volume production of its 2nm (N2) process on December 31, 2025, marking the world's first commercial deployment of gate-all-around (GAA) nanosheet transistors at this node.
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Space Forge Fires Up First Plasma-Based Semiconductor Factory in Orbit
The Milestone In January 2026, Welsh startup Space Forge successfully generated plasma aboard its ForgeStar-1 satellite—a world first for commercial in-space manufacturing. The microwave-oven-si
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Congress Moves to Extend CHIPS Act Equipment Tax Credit Beyond 2026
The Tax Credit at Stake Section 48D of the U.S. tax code—the Advanced Manufacturing Investment Credit (AMIC)—provides an investment tax credit for semiconductor manufacturing equipment and
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Applied Materials Rallies Samsung, Micron, and SK hynix for $5 Billion Deposition and Plasma R&D Hub in Silicon Valley
Overview Applied Materials is assembling the three largest memory chipmakers in the world—Samsung Electronics, Micron Technology, and SK hynix—under one roof at its new EPIC Center in Silicon Valley.
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ALD Equipment Market Reaches $7.9 Billion as Deposition Steps per Wafer Surge 20 Percent
Market Size and Projections The global atomic layer deposition (ALD) equipment market reached $7.91 billion in 2026, according to Mordor Intelligence, and is projected to climb to $12.93 billion by 20
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