Semiconductor
Etching, deposition, and plasma treatment for device R&D and pilot-line process modules.
Industrial Precision. Scientific Confidence.
Engineering Plasma Process Solutions
Semiconductor process equipment engineered for research and advanced manufacturing, including ICP-RIE, RIE, PECVD, ALD, sputtering, and thin-film processing systems.
Trusted by universities, national laboratories, and semiconductor innovators.
12+
Equipment Platforms
50+
Supported Processes
20+
Research Applications
2-Year
Standard Warranty
Process Capability
Start with the process, then choose the platform.
Engineers do not shop by catalog first. They look for a stable process window, compatible materials, and equipment that can reproduce the result.
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Silicon Etching
Equipment
ICP-RIERIEDRIE
Applications
MEMSAdvanced PackagingFailure Analysis
Resources
Deep Silicon Bosch ProcessCompare ICP-RIE vs RIETSV
Applications
Built around the work researchers actually need to do.
Diamond
Process development for diamond, SiC, GaN, and other wide-bandgap material research.
Advanced Packaging
TSV, wafer-level packaging, hybrid bonding, passivation, and thin-film stack workflows.
MEMS
Deep silicon etch, release, and precision plasma process steps.
Equipment Platforms
Choose the platform that matches the process window.
Platform
ICP-RIE
High-density plasma etching for demanding research processes.
Deep silicon etchingMEMS fabricationDiamond processing
Key Specifications
- Wafer Size
- 4-12 in
- Gas System
- 5 lines std.
- Stage Temp
- -70 to 200 C
- RF Power
- 1000-3000 W
Platform
RIE
Reliable anisotropic etching for universities and R&D labs.
Semiconductor R&DSurface activationDevice prototyping
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Platform
PECVD
Plasma-enhanced thin-film deposition for research stacks.
Dielectric filmsPassivationLow-temperature deposition
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Platform
ALD
Conformal atomic-layer films for precise device structures.
Barrier layers3D structuresAngstrom-scale films
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Platform
Sputter
Physical vapor deposition for metals and functional films.
MetallizationElectrodesThin-film stacks
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Platform
IBE/RIBE
Directional ion beam processing for precise material removal.
Failure analysisDevice trimmingLow-damage etching
View PlatformFeatured platforms shown above
Explore the full lineup, including E-Beam Evaporation, HDP-CVD, Coater/Developer, stripping, and plasma cleaner systems.
Research Validation
Peer-reviewed validation for the platforms we represent.
Independent labs at universities and research institutes have used the plasma, deposition, and vacuum process platforms we represent in their published work.
Knowledge Center
Process notes for engineers who need a faster first decision.
Designed & Supported in the USA
Engineering-first Design
Two-Year Standard Warranty
Global Research Customers
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Let’s Build Your Next Process Together
Tell us your material stack, target process, and lab requirements. A NineScrolls engineer can help map the right platform and configuration.
2-Year Warranty
Global Support
Custom Configuration
Research Labs Worldwide