Space-Constrained Labs
The SV-RIE format fits RIE capability into a compact footprint for universities, shared labs, and pilot-scale environments.
630mm x 600mmOne-piece designResearch lab fit
Equipment Platform
Compact Benchtop RIE Etcher (SV-RIE)
A space-efficient SV-RIE platform for labs that need true anisotropic plasma etching capability without the footprint of a full-size RIE system.
Models
300 / 500 / 1000 W
Wafer Size
4-12 in
Footprint
630mm x 600mm
Best For
R&D / FA labs
Process-first configuration
Bring true RIE control into smaller research spaces.
Compact RIE selection starts with the materials you need to etch, target anisotropy, available lab footprint, RF power requirement, gas chemistry, and whether the workflow is routine resist removal, failure analysis, or rapid device prototyping.
Polymer And Resist Workflows
Supports common PR, PMMA, organic polymer, and descum workflows where plasma cleaner capability is not enough.
PR removalPMMA etchingO2 plasma workflows
Failure Analysis And Prototyping
Useful for package opening, passivation access, and rapid process development where labs need responsive in-house etch access.
Failure analysisPassivation removalRapid R&D
Core Process Windows
What this compact platform is built to control.
Footprint efficiency
The defining constraint is lab space: SV-RIE keeps true reactive ion etching capability visible for teams that cannot allocate a full-size system footprint.
RF power scaling
Three model options let labs choose 300 W, 500 W, or 1000 W RF power without carrying unnecessary industrial features.
Lab-scale process flexibility
The platform is positioned for silicon, dielectric, polymer, PR, PMMA, and compound semiconductor process stacks in R&D settings.
Technical Specifications
Clear screening values for Compact RIE process planning.
Core values are taken from the equipment summary and legacy page for fast process screening. Final gas manifold, pump, wafer handling, and model configuration should be confirmed with engineering during quote review.
- Models
- SHL100SV-RIE / SHL150SV-RIE / SHL200SV-RIE
- Wafer Size
- 4-12 in
- RF Power
- 300-1000 W
- Frequency
- 13.56 MHz
- Footprint
- 630mm x 600mm
- Materials
- Si, SiO2, SiNx, SiC, PR, PMMA, compound semiconductors
- Process Gases
- Up to 5 gas lines
- Pump System
- Mechanical pump standard / optional turbo pump
Applications
Built for compact R&D etch workflows.
Space-constrained research labs
Failure analysis
Photoresist removal
Polymer descum
Passivation layer removal
Rapid device prototyping
Research evidence
Peer-reviewed research
Related Resources
Help engineers choose the right compact etch path.
Resource
Reactive Ion Etching Guide
RIE principles, process control, and equipment selection
Resource
Semiconductor Etchers Overview
How to choose RIE, ICP-RIE, DRIE, IBE, and compact etch platforms
Resource
PE vs RIE vs ICP-RIE
Plasma mode comparison for process and equipment planning
FAQ
Frequently Asked Questions
What makes the Compact RIE different from a standard RIE system?
The Compact RIE (SV-RIE) is designed around a 630mm x 600mm footprint, roughly 50% smaller than a standard RIE configuration, while preserving true reactive ion etching capability for research and failure analysis workflows.
What materials can the Compact RIE process?
The Compact RIE supports silicon, silicon dioxide, silicon nitride, silicon carbide, photoresist, PMMA, organic polymers, and compound semiconductor process stacks used in R&D and lab-scale prototyping.
Which RF power options are available?
The SV-RIE family includes SHL100SV-RIE, SHL150SV-RIE, and SHL200SV-RIE configurations, corresponding to 300 W, 500 W, and 1000 W RF power options.
Request a quote
Fit a true RIE process window into your lab
Share your target films, wafer size, process gases, RF power needs, available footprint, and timeline.