Skip to main content

Flagship RF Plasma Cleaner

PLUTO-F Flagship RF Plasma Cleaner

A 500 W RF plasma cleaner with ~14.5L aluminum alloy chamber and a 205 x 205 mm electrode for high-power cleaning, large batches, and multi-user core facilities.

Configuration

$15,999

RF (13.56 MHz) configuration

PLUTO-F flagship RF plasma cleaner

Chamber

~14.5 L

RF Power

500 W

Gas Lines

2

Chamber Material

6061-T6

High-Power Batch Processing

500 W RF processing for large batches and stubborn contamination.

PLUTO-F pairs a 500 W RF source with a ~14.5L aluminum alloy chamber, shortening process cycles and handling contamination that lower-power systems leave behind.

High-Power Cleaning

Aggressive contaminant removal with continuously adjustable 0-500 W RF.

1 W power precisionO2 / N2 / Ar

Large Batches

Process wafers, devices, and components together in a ~14.5L chamber.

240 x 300 x 200 mm chamber205 x 205 mm electrode

Aluminum Alloy Chamber

A 6061-T6 chamber gives the widest process volume in the benchtop range.

240 x 300 x 200 mm14.5 L

Use Cases

Built for high-power, multi-user plasma workflows.

Compare PLUTO-M

Core Facility Workflows

One platform covers the range of processes a shared lab is asked for.

Large-Batch Preparation

Clean and activate multiple wafers, devices, or components per run.

Process Development

A wide 0-500 W window supports aggressive and delicate recipes on one platform.

Specifications

PLUTO-F configuration window

Representative PLUTO-F configuration from the equipment summary and legacy datasheet table. Confirm process-specific requirements during quote review.

Chamber
~14.5 L, 6061-T6 aluminum alloy
Chamber Size
240 x 300 x 200 mm
RF Power
0-500 W, 1 W precision
Frequency
13.56 MHz, auto-impedance matching
Electrode
205 x 205 mm flat plate
Gas Lines
2 lines, needle valve control (O2 / N2 / Ar)
Vacuum
Oil or dry pump, optional
Vacuum Gauge
Thermocouple, 0-100 kPa
Control
4.3 in touchscreen, multi-level menu
System Size
405 x 670 x 610 mm (W x D x H)
Electrical
208–240 VAC, single-phase, 60 Hz

Applications

Where PLUTO-F fits

High-power plasma cleaning

Large-batch surface activation

Wafer and device preparation

High-power surface treatment

Multi-user core facilities

Semiconductor process development

Research evidence

Peer-reviewed research

Published work using the plasma cleaner platform we represent · 2 papers

  • Deep learning-driven microfluidic chip architecture design for intelligent particle motion control

    Lab on a Chip 2026

    View source
  • Design and Fabrication of Ultrathin Metallic Phase Shifters for Visible and Near-Infrared Wavelengths

    Micromachines 2025

    View source

System Views

System Views

Use these actual system photos to review the ~14.5L chamber, electrode format, and complete vacuum system before configuration review.

PLUTO-F open chamber with batch tray
Open chamber
PLUTO-F chamber interior with flat plate electrode
Chamber interior
PLUTO-F complete system with vacuum pump
Complete system

FAQ

Frequently Asked Questions

How is PLUTO-F different from PLUTO-M?

PLUTO-F moves to a ~14.5L aluminum alloy chamber with 500 W of RF power against the 200 W of the PLUTO-M, and to a 205 x 205 mm electrode against its 125 x 125 mm gas-shower plate. PLUTO-M is the ~8L, 200 W mid-capacity option, and is the one that ships with its vacuum pump included.

Can PLUTO-F be purchased directly?

Yes. PLUTO-F can be ordered directly, and institutional buyers can also request a budgetary quote for PO-based purchasing.

Ready to Configure

Choose PLUTO-F for high-power batch plasma processing.

Order directly or request a budgetary quote for institutional purchasing.