High-Power Cleaning
Aggressive contaminant removal with continuously adjustable 0-500 W RF.
1 W power precisionO2 / N2 / Ar
Flagship RF Plasma Cleaner
PLUTO-F Flagship RF Plasma Cleaner
A 500 W RF plasma cleaner with ~14.5L aluminum alloy chamber and advanced recipe management for high-power cleaning, large batches, and multi-user core facilities.
Chamber
~14.5 L
RF Power
500 W
Gas Lines
2
Recipes
Multi-step
High-Power Batch Processing
500 W RF processing for large batches and stubborn contamination.
PLUTO-F pairs a 500 W RF source with a ~14.5L aluminum alloy chamber, shortening process cycles and handling contamination that lower-power systems leave behind.
Large Batches
Process wafers, devices, and components together in a ~14.5L chamber.
240 x 300 x 200 mm chamber205 x 205 mm electrode
Advanced Recipes
Multi-step recipe sequences stay reproducible across users and sessions.
Store and recall recipesCore facility ready
Use Cases
Built for high-power, multi-user plasma workflows.
Core Facility Workflows
Recipe locking and multi-step sequences keep shared-lab processing consistent.
Large-Batch Preparation
Clean and activate multiple wafers, devices, or components per run.
Process Development
A wide 0-500 W window supports aggressive and delicate recipes on one platform.
Specifications
PLUTO-F configuration window
Representative PLUTO-F configuration from the equipment summary and legacy datasheet table. Confirm process-specific requirements during quote review.
- Chamber
- ~14.5 L, 6061-T6 aluminum alloy
- Chamber Size
- 240 x 300 x 200 mm
- RF Power
- 0-500 W, 1 W precision
- Frequency
- 13.56 MHz, auto-impedance matching
- Electrode
- 205 x 205 mm flat plate
- Gas Lines
- 2 lines, needle valve control (O2 / N2 / Ar)
- Vacuum
- Oil pump included; dry pump optional
- Control
- 4.3 in touchscreen, advanced recipe management
- System Size
- 405 x 610 x 670 mm
Applications
Where PLUTO-F fits
High-power plasma cleaning
Large-batch surface activation
Wafer and device preparation
High-power surface treatment
Multi-user core facilities
Semiconductor process development
System Views
System Views
Use these actual system photos to review the ~14.5L chamber, electrode format, and complete vacuum system before configuration review.
Resources
Related Resources
FAQ
Frequently Asked Questions
How is PLUTO-F different from PLUTO-M?
PLUTO-F moves to a ~14.5L aluminum alloy chamber with 500 W of RF power — for faster cycles, larger batches, and harder-to-clean contamination — and adds advanced multi-step recipe management for shared facilities. PLUTO-M is the ~8L, 200 W mid-capacity option.
Can PLUTO-F be purchased directly?
Yes. PLUTO-F can be ordered directly, and institutional buyers can also request a budgetary quote for PO-based purchasing.
Ready to Configure
Choose PLUTO-F for high-power batch plasma processing.
Order directly or request a budgetary quote for institutional purchasing.