High-Purity E-Beam Films
Localized e-beam heating supports refractory metals, oxides, fluorides, and IR-active materials while keeping the crucible water-cooled.
10 kW e-gun6-pocket crucibleHigh purity
Equipment Platform
MEB-600 E-Beam Evaporation Platform
Multi-source e-beam and thermal evaporation for infrared sensors, photonic crystals, optical multilayers, lift-off metallization, and research-grade PVD thin films.
Substrate
Φ6 in x1 flat
Crucible
6x17 cc
Uniformity
≤±5% @ Φ6 in
Vacuum
6.7×10⁻⁵ Pa
Process-first configuration
Build the PVD stack around source material, purity, and directional deposition.
E-beam evaporator selection starts with source material volatility, melting point, target film purity, lift-off profile, QCM control requirements, substrate fixture, multilayer sequencing, and whether low-melting layers need thermal evaporation in the same chamber.
Thermal Evaporation
Integrated thermal-resistance evaporation supports low-melting metals and organic small molecules without moving to a second tool.
3 kW thermalLow-melt metalsOrganics
Optical and IR Stacks
QCM endpoint control and multi-pocket sequencing support IR sensors, Ge/ZnS photonic crystals, AR coatings, and multilayer PVD stacks.
QCM endpointIR materialsMultilayers
Core Process Windows
What this platform is built to control.
Source and material selection
E-beam and thermal sources in one chamber let labs mix refractory, optical, low-melting, and organic materials in a single PVD workflow.
Thickness and endpoint control
In-situ quartz-crystal monitoring supports rate and thickness control for optical stacks, sacrificial layers, and device metallization.
Directional lift-off deposition
Line-of-sight evaporation is well suited to lift-off metallization, MEMS contacts, optoelectronic devices, and quantum hardware layers.
Technical Specifications
Key specifications for MEB-600 process planning and system selection.
Review core platform capabilities for initial process planning. Our engineering team will confirm the final fixture, crucible, pump, monitor, and automation options during quote review.
- Substrate
- Φ6 in x1 flat substrate holder
- Substrate Heating
- RT to 300 °C
- Substrate Rotation
- 1–10 rpm
- E-Gun Crucible
- 6 pockets, 17 cc each
- E-Beam Power
- ~10 kW
- Uniformity
- ≤±5% within Φ6 in
- Thickness Control
- In-situ QCM endpoint
- Vacuum
- 6.7×10⁻⁵ Pa ultimate vacuum
- Modes
- Manual / semi-auto / full-auto
- Sources
- E-beam + thermal resistance
- Materials
- Metals, oxides, fluorides, IR films
Applications
Built for high-purity PVD films and optical device stacks.
Infrared image sensors
Ge/ZnS photonic crystals
UV down-conversion films
Optical AR coatings
Lift-off metallization
Quantum device thin films
Research evidence
Peer-reviewed research
Published work using the MEB-600 e-beam evaporation platform · 2 papers
- View source
Coronene Enhanced CMOS Image Sensor
Ultraviolet down-conversion coronene film thermally evaporated onto CMOS image sensors to extend their UV response.
Journal of Infrared and Millimeter Waves 2023
- View source
Dimension-Confined Growth of a Crack-Free PbS Microplate Array for Infrared Image Sensing
Crack-free PbS microplate arrays for infrared image sensing, with evaporation of PbS/MgO process layers.
ACS Applied Materials & Interfaces 2024
Related Resources
Help engineers choose the right PVD and pattern-transfer path.
Resource
E-Beam vs Thermal vs Sputter
PVD technique selection across evaporation, thermal, and sputtering workflows
Resource
Hard Mask Processing
Mask materials, evaporation, deposition choices, and pattern-transfer integration
Resource
Quantum Device Fabrication
Thin-film deposition, lift-off, and quantum hardware process integration
FAQ
Frequently Asked Questions
When should I choose e-beam evaporation instead of sputtering?
Choose e-beam evaporation for high-purity directional deposition, lift-off metallization, optical multilayers, and refractory or IR-active source materials. Choose sputtering when compound film stoichiometry, magnetic films, or broader step coverage are the primary drivers.
What makes the MEB-600 a multi-source platform?
The MEB-600 combines e-beam evaporation and thermal-resistance evaporation in one high-vacuum chamber. The e-gun uses a 6-pocket, 17 cc-per-pocket crucible, allowing sequential materials without breaking vacuum.
What core specifications define the MEB-600?
The MEB-600 supports a Φ6 in x1 flat substrate holder, a 6-pocket 17 cc e-gun crucible, ~10 kW e-beam power, RT to 300 °C substrate heating, ≤±5% uniformity within Φ6 in, in-situ QCM endpoint detection, 6.7×10⁻⁵ Pa ultimate vacuum, and manual, semi-auto, or full-auto modes.
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