High-Purity E-Beam Films
Localized e-beam heating supports refractory metals, oxides, fluorides, and IR-active materials while keeping the crucible water-cooled.
10 kW e-gun6-pocket crucibleHigh purity
Equipment Platform
MEB-600 E-Beam Evaporation Platform
Multi-source e-beam and thermal evaporation for infrared sensors, photonic crystals, optical multilayers, lift-off metallization, and research-grade PVD thin films.
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This platform is configured and quoted to your process — it is not sold online.
Substrate
Φ6 in x1 flat
Crucible
6x17 cc
Uniformity
≤±5% @ Φ6 in
Vacuum
6.7×10⁻⁵ Pa
Process-first configuration
Build the PVD stack around source material, purity, and directional deposition.
E-beam evaporator selection starts with source material volatility, melting point, target film purity, lift-off profile, QCM control requirements, substrate fixture, multilayer sequencing, and whether low-melting layers need thermal evaporation in the same chamber.
Thermal Evaporation
Integrated thermal-resistance evaporation supports low-melting metals and organic small molecules without moving to a second tool.
3 kW thermalLow-melt metalsOrganics
Optical and IR Stacks
QCM endpoint control and multi-pocket sequencing support IR sensors, Ge/ZnS photonic crystals, AR coatings, and multilayer PVD stacks.
QCM endpointIR materialsMultilayers
Core Process Windows
What this platform is built to control.
Source and material selection
E-beam and thermal sources in one chamber let labs mix refractory, optical, low-melting, and organic materials in a single PVD workflow.
Thickness and endpoint control
In-situ quartz-crystal monitoring supports rate and thickness control for optical stacks, sacrificial layers, and device metallization.
Directional lift-off deposition
Line-of-sight evaporation is well suited to lift-off metallization, MEMS contacts, optoelectronic devices, and quantum hardware layers.
Technical Specifications
Clear screening values for MEB-600 process planning.
Core values are taken from the MEB-600 technical specification for fast process screening. Final fixture, crucible, pump, monitor, and automation options should be confirmed with engineering during quote review.
- Substrate
- Φ6 in x1 flat substrate holder
- Substrate Heating
- RT to 300°C
- Substrate Rotation
- 1–10 rpm
- E-Gun Crucible
- 6 pockets, 17 cc each
- E-Beam Power
- ~10 kW
- Uniformity
- ≤±5% within Φ6 in
- Thickness Control
- In-situ QCM endpoint
- Vacuum
- 6.7×10⁻⁵ Pa ultimate vacuum
- Modes
- Manual / semi-auto / full-auto
- Sources
- E-beam + thermal resistance
- Materials
- Metals, oxides, fluorides, IR films
Applications
Built for high-purity PVD films and optical device stacks.
Infrared image sensors
Ge/ZnS photonic crystals
UV down-conversion films
Optical AR coatings
Lift-off metallization
Quantum device thin films
Related Resources
Help engineers choose the right PVD and pattern-transfer path.
Resource
E-Beam vs Thermal vs Sputter
PVD technique selection across evaporation, thermal, and sputtering workflows
Resource
Hard Mask Processing
Mask materials, evaporation, deposition choices, and pattern-transfer integration
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Quantum Device Fabrication
Thin-film deposition, lift-off, and quantum hardware process integration
FAQ
Frequently Asked Questions
When should I choose e-beam evaporation instead of sputtering?
Choose e-beam evaporation for high-purity directional deposition, lift-off metallization, optical multilayers, and refractory or IR-active source materials. Choose sputtering when compound film stoichiometry, magnetic films, or broader step coverage are the primary drivers.
What makes the MEB-600 a multi-source platform?
The MEB-600 combines e-beam evaporation and thermal-resistance evaporation in one high-vacuum chamber. The e-gun uses a 6-pocket, 17 cc-per-pocket crucible, allowing sequential materials without breaking vacuum.
What core specifications define the MEB-600?
The MEB-600 supports a Φ6 in x1 flat substrate holder, a 6-pocket 17 cc e-gun crucible, ~10 kW e-beam power, RT to 300°C substrate heating, ≤±5% uniformity within Φ6 in, in-situ QCM endpoint detection, 6.7×10⁻⁵ Pa ultimate vacuum, and manual, semi-auto, or full-auto modes.
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Build your next evaporation stack with NineScrolls
Share your source materials, substrate size, desired film thickness, QCM requirements, multilayer sequence, lift-off constraints, and timeline.