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Batch RF Plasma System

PLUTO-30 Batch RF Plasma System

A 30L floor-standing RF plasma system with one to four electrode pairs, two mass flow controllers, and a 7 in touchscreen for repeatable batch cleaning, activation, and surface treatment.

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This platform is configured and quoted to your process — it is not sold online.

PLUTO-30 batch RF plasma system

Chamber

30 L

RF Power

0-500 W

Electrode Pairs

1-4

Gas Control

2 MFCs

Batch And Pilot-Scale Plasma

Digital gas control and stacked electrode pairs in one system.

PLUTO-30 pairs a 0-500 W RF source and automatic matching network with a 30L floor-standing chamber, one to four electrode pairs, and two mass flow controllers. Recipes and permissions live on a 7 in touchscreen so shared teams get repeatable batch results.

Stacked-Pair Batch Cleaning

Each electrode pair takes one sample; a fully configured machine runs four per batch.

30 L chamber1-4 electrode pairs30 mm adjustable gap

MFC Gas Control

Two mass flow controllers (0-200 ml) plus CDA and vent lines support repeatable, tunable chemistry.

2 MFCs standardRecipe storageAuto / manual modes

Flexible Electrodes

Insert-rod 6061-T6 electrodes and tuned gas distribution enable fast changeover between products and processes.

CleaningActivationSurface modification

Use Cases

Built for higher-throughput batch and pilot plasma workflows.

Compare PLUTO-F

R&D To Pilot Production

A floor-standing batch system that bridges lab development and small-batch production.

Surface Activation

Activation for adhesion, bonding, and coating preparation, up to four samples per load.

Descum And Light Etch

Timed, MFC-controlled recipes for residue removal and light etch work.

Specifications

PLUTO-30 configuration window

Review the PLUTO-30 capabilities for initial system selection. PLUTO-30 is a surface-treatment system for cleaning, activation, and surface modification — it is not a fluorine-based reactive ion etcher. Process control is timed; endpoint detection is not included and the electrode shelves are unheated. Confirm electrode-pair count, gas lines, and pump selection during quote review.

Chamber
30 L, 300 x 366 x 280 mm (W x D x H)
Chamber Material
Leak-tested 316 stainless steel
Electrodes
Powered and ground 226 x 210 mm, insert-rod 6061-T6 aluminum
Electrode Configuration
One pair standard, expandable to four pairs
Batch Capacity
One sample per electrode pair, up to 4 per run
Electrode Gap
30 mm, adjustable
RF Power
0-500 W continuously adjustable, 1 W resolution
Frequency
13.56 MHz, automatic impedance matching
Gas Control
2 MFCs standard (0-200 ml), plus CDA and vent lines
Vacuum Control
Pirani sensor, 1% accuracy, full safety interlocks
Control
7 in touchscreen, stored recipes, operator permission levels
Process Timer
1-9999 seconds
Alarms
Low vacuum, low gas supply pressure, incorrect process gas
Vacuum Pump
Rotary oil vacuum pump (quoted separately)
System Size
706 x 920 x 1415 mm (W x D x H)
Electrical
208–240 VAC, single-phase

Applications

Where PLUTO-30 fits

Batch plasma cleaning

Surface activation

Descum and light etch

Adhesion and bonding preparation

Pilot production

Core facility workflows

System Views

System Views

Actual PLUTO-30 system photos: the open chamber with its electrode pair, the complete floor-standing unit, an installed cleanroom scene, and chamber dimensions.

PLUTO-30 complete floor-standing plasma system
Complete system
PLUTO-30 installed and running in a cleanroom
In use
PLUTO-30 chamber interior dimensions
Chamber dimensions

FAQ

Frequently Asked Questions

How is PLUTO-30 different from the benchtop PLUTO cleaners?

PLUTO-30 steps up from the benchtop 4-14L cleaners to a 30L floor-standing chamber (1.4 m tall) with insert-rod electrodes, two mass flow controllers, and a 7 in touchscreen with recipe storage. It ships with one electrode pair and takes four at most, so a fully configured machine runs four samples per batch — one per pair.

What processes does PLUTO-30 support?

PLUTO-30 handles plasma cleaning, surface activation, and surface modification, including timed descum and light etch work. It is not a fluorine-based reactive ion etcher: process control is timed, endpoint detection is not included, and the electrode shelves are unheated. MFC-controlled gas distribution lets one system move quickly between recipes and store validated process menus.

Can PLUTO-30 be purchased directly?

PLUTO-30 is configured per application and quoted directly. Share your samples, throughput, and gas chemistry and we will confirm the electrode-pair count, gas lines, and vacuum pump during quote review.

Request a Quote

Scale plasma processing to batch and pilot production with PLUTO-30.

Share your samples, throughput, and gas chemistry for an application-matched configuration.