Spin Coating Control
High-speed coater modules support programmable spin profiles, acceleration control, dispense timing, and repeatable coating thickness for research lithography.
Up to 8000 rpmRecipe controlResist dispense
Equipment Platform
Coater/Developer Photolithography Track Platform
Modular spin coating, development, hotplate, HMDS, and EBR process control for repeatable photolithography workflows from research wafers to pilot-line substrates.
Wafer Size
Pieces to 12 in
Coater Speed
8000 rpm
Hotplate
RT to 200 °C
Developer Speed
5000 rpm
Process-first configuration
Build the lithography track around coating uniformity, bake timing, and developer control.
Coater/developer selection starts with substrate size, resist chemistry, target film thickness, spin profile, dispense strategy, bake queue time, developer method, EBR need, and whether the workflow needs integrated coat, develop, and hotplate modules rather than manual transfers.
Develop And Rinse
Developer modules support puddle, spray, or multi-step development strategies with developer lines, DI rinse, and process timing control.
2 developer linesDI waterPuddle / spray
Bake And Queue Timing
Integrated hotplate modules reduce uncontrolled coat-to-bake and exposure-to-PEB delays that can drive CD variation and process drift.
RT to 200 °CPEB timingSoft bake
Core Process Windows
What this platform is built to control.
Thickness uniformity
Spin speed, acceleration, dispense position, resist viscosity, cup airflow, and EBR tuning all contribute to repeatable film-thickness uniformity.
Recipe repeatability
Integrated coat, develop, and hotplate recipes reduce operator-dependent variation across spin steps, bake timing, development, rinse, and dry sequences.
Module configuration
Track layouts can be selected around coater count, developer count, hotplate capacity, resist lines, developer chemistry, and throughput needs.
Technical Specifications
Clear screening values for photolithography track planning.
Core values are taken from the equipment summary, equipment guide, and legacy page for fast process screening. Final module layout, chemical lines, chuck set, EBR, hotplate, and environmental controls should be confirmed with engineering during quote review.
- Wafer Size
- Pieces to 12 in
- Coater Speed
- Up to 8000 rpm +/-1 rpm
- Developer Speed
- Up to 5000 rpm +/-1 rpm
- Hotplate
- RT to 200 °C
- Dispense
- 2 resist lines + 2 developer lines + DI
- Footprint
- Approx. 1.0m x 0.8m
- EBR
- Optional edge bead removal
Applications
Built for repeatable lithography coating and development workflows.
Photoresist coating
HMDS priming
Developer processing
Lift-off preparation
Thick film processing
Edge bead removal
Research evidence
Peer-reviewed research
Related Resources
Help engineers choose the right lithography track path.
Resource
Coater/Developer Equipment Guide
Track system architecture, module configurations, uniformity optimization, hotplate integration, and equipment selection
Resource
Spin Coating & Development Guide
Spin coating physics, resist selection, development optimization, defects, and process troubleshooting
Resource
Lithography Process Integration
Substrate preparation, HMDS, coating, bake, exposure, development, etch transfer, and resist strip integration
FAQ
Frequently Asked Questions
When should I choose a coater/developer track instead of a manual spin coater?
Choose a coater/developer track when repeatable recipes, controlled coat-to-bake timing, developer integration, hotplate modules, EBR, and operator-independent uniformity matter more than single-step manual coating.
What modules can be configured on the Coater/Developer platform?
The platform can be configured around coater, developer, hotplate, dispense, EBR, and environmental-control modules. Final module count and layout should be selected around substrate size, resist family, developer chemistry, throughput, and cleanroom workflow.
What core specifications define the Coater/Developer platform?
Core specifications include pieces to 12 inch wafers, coater speed up to 8000 rpm +/-1 rpm, developer speed up to 5000 rpm +/-1 rpm, RT to 200 °C hotplate operation, 2 resist lines, 2 developer lines plus DI, and an approx. 1.0m x 0.8m footprint.
Request a quote
Build your next lithography track workflow with NineScrolls
Share your substrate sizes, resist family, target thickness, developer chemistry, bake steps, EBR needs, module count, and throughput goals.