Processes
Start with the process, then choose the platform.
Five process families, each mapped to equipment, applications, and process notes.
Core process
Silicon Etching
Deep silicon etching anchors MEMS release structures, through-silicon vias, and device prototyping alike. The Bosch process alternates etch and passivation cycles to hold vertical profiles at high aspect ratios.
ICP-RIE platforms provide the high-density plasma the deep etches need; RIE covers general anisotropic patterning where a simpler chamber does the job.
Core process
Thin Film Deposition
Device stacks are built film by film: plasma-enhanced deposition covers dielectrics and passivation at low temperature, while atomic-layer deposition reaches conformal coverage on 3D structures.
PECVD, ALD, and sputtering platforms cover the dielectric, barrier, and metal films that research stacks combine.
Equipment
Specialized
Diamond Semiconductor Processing
Wide-bandgap materials call for higher plasma densities, harder masks, and tighter damage control than silicon processes — diamond most of all.
ICP-RIE provides the ion energy and density these materials demand; PECVD supports the dielectric and hard-mask films around the etch.
Resources
Specialized
Advanced Packaging
Wafer-level packaging research combines via etching, dielectric deposition, and bonding surface preparation into a single flow whose steps must stay compatible.
ICP-RIE, PECVD, and ALD platforms cover the etch and film steps; plasma surface activation prepares wafers for hybrid bonding.
Resources
Specialized
Failure Analysis
Failure analysis works backwards: delayering and cross-section preparation must remove material precisely without disturbing the evidence underneath.
Ion-beam etching gives directional, low-damage removal; RIE and plasma cleaning cover delayering and surface treatment around it.
Equipment
Resources
Next step
Bring us the process window.
Share your materials, features, and constraints; our engineering team will map the platform and configuration.